So here’s a simple hack to get a breakout board with two inline headers onto a breadboard nicely. My latest project involves TI’s EZ430-RF2500 which is quite a nice setup to get a wireless project up and running quickly. Unfortunately the breakout pins are aligned in 2 parallel rows on the side of the board making it impossible to plug directly into a breadboard.
Ideally this board should be connected in the center of a breadboard like a DIP package. So the challenge is how do you convert 0.1″ spacing into DIP package spacing?? Here’s my solution.
1.) Solder header into the breakout pin holes and *cut off the pins on the outside row*. Then place it into a bread board with a single row of header next to it.
2.) Solder a second single row of header across the outside row of the breakout board to the header on the opposite side of the divide.
3.) Presto! Complete transformation from 0.1″ spacing to DIP package. Ready to prototype. Cool.